Hartnett Consulting LLC
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Hartnett Consulting LLC
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  • Contact Us

Our Services

Parts, Materials and Processes Systems

 Evaluation, Documentation Generation and Gap Analysis 

  • Practice and general standard for Parts, Materials, and Processes and references specifications relating to PWB, PWA, EEE components qualification and testing, chemical processing –electroplating, electroless plating, corrosion prevention, chemical, analytical techniques, and as need problem solving.
  • GEIA-Std-0005-2A “Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High-Performance Electronic Systems”
  • GEIA-Std-0006 “Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts”
  • Pinsky Risk Calculations for Risk Mitigation of Tin Whiskers
  •  Service Life Analysis and Environmental Testing Methodology 
  • Accelerated Life testing 
  • ESD Requirements
  • Mil Std 11991 “Military Standard: Electrical, Electronic, And Electro-Mechanical Equipment, Guided Missile And Associated Weapon Systems, General Standard”
  • SMC-S-011” Space And Missile Systems Center Standard Parts, Materials, And Processes Control Program For Launch Vehicles”
  • Automotive Production Part Approval Process (PPAP)

Printed Wiring Board & Printed Wiring Assembly

 

  • Bare Boards       

                  - Lamination       

                  - PTH      

                  - Print and Etch       

                  - Additive 

  • Material Control       

                  - Substrate      

                  - Resists       

                  - Solder      

                  - Chemicals       

                  - Equipment 

  • Soldering      

                  - SMT       

                  - Wave       

                  - Hand 

  • Assembly      

                  - Material Flow      

                  - Preventative Maintenance

  • Hybrid Soldering Processes to Mitigate Tin Whiskers 

Chemical Processes and Analysis

 

  • Process Design

                 - Powders                  

                 - Plating                        

                 - Electroplating                       

                 - Pulse Electroplating                       

                 - Electroless Plating

  • Material Analysis

                  - Optical                  

                  - Cross Section                   

                  - SEM/EDS

  • Process Recommendations

                 - Plated Through Hole                  

                 - Corrosion Protection

  • PWB Ionic Contamination Analysis and Process Control    

Technical Writing

  • REST API Reference and Developer Guides
  • Software Installation and User Guides
  • Business Analysis


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